T/F Device "TF303"
Deburring of semiconductor frames, tie bar cutting, lead molding, and storage device for tubes after separation.
A device for cutting off devices from the semiconductor frame and storing them in a tube. It uses a mold with a servo press. Compatible with multi-row matrix frames. Includes brushing to remove burrs from the lead parts of the individual devices. Stored in a plastic tube.
- Company：綜和機電
- Price：Other
